Intel chose the supposedly more advanced SAQP lithography technology, and that ended up with very unstable yield, while TSMC kept on perfecting the tried and true EUV technology. Every time physical limitations impose on continued scaling using the old technology presents an opportunity for the board to be shuffled. Intel was ahead all the way up to 14nm when they chose the wrong path to go forward. That doesn’t mean their original choice won’t be the right one down the road, or they won’t pick a better technology next time. It’s extremely costly to even pick one solution, it’s often all or nothing.